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Patent Applications & Technology Development

Year R&D Projects
  • 2018
    • Development of AgZnO-based contact materials
  • 2019
    • Development of surface treatment processes for precious metal alloy thin sheets
  • 2019~2021
    • Development of RoHS-free contact materials
  • 2020~2022
    • Development of high-speed bending equipment for free-form shaping of EV battery busbars
  • 2020~2023
    • Localization of manufacturing of core materials for semiconductor probe pins
  • 2022
    • Development of high-indium brazing materials and processing technologies
  • 2023
    • Development of eco-friendly (Cd-free) high-strength brazing materials for diamond tool bonding
    • Development of a real-time thickness and width measurement system for wire rolling processes
  • 2023~2024
    • Development of high-purity Ag thin sheets for banknote-type commemorative coins
    • Ag powder melting & reduction process with low contamination, high productivity, and low defects
  • 2024
    • Development of high-hardness Ag materials for contact-type sensors
    • Development of eco-friendly (Cd-free) post-oxidized plate contacts for medium-voltage switchgear
    • Development of an automated heat treatment system with solution treatment and automatic water quenching
Achievement Year 2023

Development of Cd-Free High-Strength
Brazing Materials for Diamond Tool Bonding

Patents

  • Patent Certificate for Post-Process Semiconductor Materials

    Patent Certificate for Post-Process Semiconductor Materials

  • PCT Patent Application Documents

    PCT Patent Application Documents

  • Domestic Patent Application Documents

    Domestic Patent Application Documents